Kontron has launched its ULP-COM standards-based Computer-on-Modules to help embedded OEMs drive down system costs for ultra-low power SFF (small form factor) solutions. Kontron’s expanded ULP-COM portfolio is designed as a highly scalable building block for the swift and cost-effective development of energy-efficient mobile devices. Featuring a low TDP (Thermal Design Power), the Kontron ULP-COM-sA3874i is well-suited for space-constrained, fanless and harsh environment applications. Offering single core ARM Cortex A8 technology performance based on Texas Instrument’s AM3874 Sitara ARM processors, Kontron’s latest ULP-COM module delivers the computing power required by the diverse range of smart devices being designed today in a small 82mm x 50mm footprint.
The Kontron ULP-COM-sA3874i module supports an operating temperature range of -40°C to +85°C and expands the scalable Computer-on-Module building block model to a broader range of SFF systems that operate in harsh environmental conditions such as those in the military, industrial automation/HMI, digital signage and medical markets. Support for Android, Linux, WEC7, and a variety of real-time operating systems on project request, enables embedded OEMs to leverage an active ecosystem of development partners.
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